描述
高速 VLSI 封装的建模、仿真与优化入门；封装、互连与地/电源平面模型；互连的集总、分布式与电磁模型；时延、串扰与开关噪声；矩匹配技术；IC 封装与电路板的并行热/电分析。
原文参考文本
Introduction to modeling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards.
来源与参考
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来源参考 : https://calendar.carleton.ca/grad/courses/ELEC/