Description
Introduction to modeling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards.
Reference text in its original language
Introduction to modeling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards.
Sources and references
Dates and sources are retained to help you verify the information. Translations are provided to facilitate reading; the official source governs conditions and requirements.
Source reference : https://calendar.carleton.ca/grad/courses/ELEC/