課程說明
高速VLSI封裝之建模、模擬與最佳化導論；封裝、互連與地/電源平面之模型；互連之集中、分布與電磁模型；延遲、串擾與切換雜訊；矩匹配技術；IC封裝與電路板之同步熱/電分析。
原文參考文本
Introduction to modeling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards.
來源與參考
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來源參考 : https://calendar.carleton.ca/grad/courses/ELEC/